Electronic apparatus

Details Electronic apparatus Electronic apparatus

1992-01-09

1992-10-06

LaRoche, Eugene R.

357 75, 357 80, H01L 2348, H01L 3902

Patent

active

051537095

ABSTRACT:
Disclosed electronic apparatus comprises a ceramic substrate, a multilayered wiring portion disposed at a distance from the periphery of the main surface of the ceramic substrate and produced by alternately repeating a conductor pattern formed by the thin-film method using a conductive metal and a polyimide layer, electronic devices mounted on the multilayered wiring portion and electrically connected to the conductor patterns of the multilayered wiring portion, input and output conductor pads formed on the periphery of the main surface of the ceramic substrate, connection conductor patterns formed on the main surface of the ceramic substrate astride the gap between the line patterns of the multilayered wiring portion and the input and output conductor pads, an inorganic insulation layer formed annularly on the main surface of the ceramic substrate across over at least part of the connection conductor patterns around the multilayered wiring portion, a metallized layer formed on the inorganic insulation layer, and a moistureproof cap having the edge thereof hermetically fixed by soldering on the metallized layer. Since the metallic cap can be fixed heremetically to the annular metallized layer and moreover since the inorganic insulation layer outside the seal ring patterns is formed of a ceramic material, this electronic apparatus produces a highly reliable operation without entailing the dangers of closed-circuit failure, corrosion, and formation of dew.

REFERENCES:
patent: 3469148 (1969-09-01), Lund
patent: 3793064 (1974-02-01), Budd et al.
patent: 4340902 (1982-07-01), Honda et al.
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 4558171 (1985-12-01), Gantley et al.
patent: 4560826 (1985-12-01), Burns et al.
patent: 4656499 (1987-04-01), Butt
patent: 4663649 (1987-05-01), Suzuki et al.
IEEE Proceedings of the 31st Electronic Components Conference, May 1981, pp. 9-17.

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