Electronic apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S707000, C257S720000

Reexamination Certificate

active

11607910

ABSTRACT:
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

REFERENCES:
patent: 4383270 (1983-05-01), Schelhorn
patent: 4628407 (1986-12-01), August et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6310391 (2001-10-01), Nagasawa et al.
patent: 6528882 (2003-03-01), Ding et al.
patent: 6545353 (2003-04-01), Mashino
patent: 0 981 268 (2000-02-01), None
patent: 06-169189 (1994-06-01), None
patent: A-6-169189 (1994-06-01), None
patent: A-7-326690 (1995-12-01), None
patent: 2000012723 (2000-01-01), None
Harper,Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, 1.48,6.71-6.73.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3959030

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.