Electron beam tester

Image analysis – Applications – Manufacturing or product inspection

Patent

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Details

382151, 382199, 348 87, G06K 900

Patent

active

056007345

ABSTRACT:
An electron beam tester scans a sample with an electron beam to provide a secondary electron image, matches wiring patterns of the secondary electron image with wiring patterns prepared from CAD data, measures voltages of the wiring patterns, and corrects deformation of the secondary electron image. The electron beam tester comprises a pattern matching unit, a wiring pattern tester, a secondary electron image corrector, a wiring pattern inspection unit, and a pattern matching processor. The pattern matching unit simply and quickly matches the wiring patterns of the secondary electron image with the wiring patterns prepared from the CAD data. The wiring pattern tester detects slippage between layers of a multilayered semiconductor chip and correctly positions the electron beam on the chip during a pattern matching operation. The secondary electron image corrector accurately and automatically corrects deformation of the secondary electron image. The wiring pattern inspection unit simply and correctly determines a threshold used for preparing a binary image, to correctly carry out a pattern matching operation. The pattern matching processor accurately detects edges out of a blurred image, to correctly carry out a pattern matching operation.

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