Electron beam shaping mask for an electron beam system with patt

Details Electron beam shaping mask for an electron beam system with patt Electron beam shaping mask for an electron beam system with patt

1995-06-02

1997-01-14

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

430 5, 430296, 430313, 430321, 430396, 430395, 430494, 359851, 369101, 428195, B32B 900

Patent

active

055937616

ABSTRACT:
An electron beam shaping mask for an electron beam with pattern writing capability, includes a substrate with various opening patterns and metallic films, which are respectively formed on top- and bottom-surfaces of the substrate. The metallic films serve as foundation metallic layers. According to the structure, a total thickness of the metallic layer is divided into the two thin metallic films. Since the substrate is protected from both sides by the metallic films, its thickness can be made to be thin. Therefore, a highly accurate patterning can be easily performed, and thermal stresses can be decreased and exfoliations of the metallic films can be avoided.

REFERENCES:
patent: 4417946 (1983-11-01), Bohlen et al.
patent: 4451544 (1984-05-01), Kawabuchi
patent: 4855197 (1989-08-01), Zapka et al.
patent: 5234781 (1993-08-01), Sakamoto et al.
patent: 5334282 (1994-08-01), Nakayama et al.
"Electron-beam cell projection lithography: A new high-throughput electron-beam direct-writing technology using a specially tailored Si aperture;" Y. Nakayama et al.; American Vacuum Society; Nov./Dec. 1990; pp. 1836-1840.
"Thermal Characteristics of Si Mask for EB Cell Projection Lithography"; Yoshinori Nakayama et al.; Jpn. J. Appl. Phys. vol. 31 (1992); pp. 4268-4272.

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