Electron beam annealing of metal step coverage

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 148 15, 148187, 357 65, 357 91, H01L 21263, H01L 21268, B05D 306

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043274773

ABSTRACT:
Defects in the metal step coverage of a thin film semiconductor device are removed by annealing the metal layer with a pulsed electron beam.

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