Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1996-12-30
1998-07-07
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, 324719, G01R 104
Patent
active
057774862
ABSTRACT:
A test pattern simulates conductors and interconnections of conductors of a multi-layer semiconductor device that may be subject to damage from electromigration. Test pattern elements are connected in a series circuit with two connection points for applying a test current to the elements. A break in this circuit or an increase in resistance during the test signifies that electromigration has damaged the test pattern and that the operating components of the device may have manufacturing defects that make them susceptible to electromigration. Probe points can be provided for testing particular parts of the series circuit. The pattern has at least one conductive stripe or other element in each layer of the device and it has interconnecting vias between these elements through one or more intervening layers of insulation where corresponding layer-to-layer interconnections are made in the operating components of the device. On the surface of the device, diffusions form part of the circuit path. The diffusions can be connected as a buried contact if the device uses this structure.
REFERENCES:
patent: 3851245 (1974-11-01), Baker et al.
patent: 3974443 (1976-08-01), Thomas
patent: 4144493 (1979-03-01), Lee et al.
patent: 4652812 (1987-03-01), Gimpelson et al.
patent: 4778771 (1988-10-01), Hiki
patent: 4942357 (1990-07-01), Chang
patent: 4954480 (1990-09-01), Imanaka et al.
patent: 5049811 (1991-09-01), Dreyer et al.
patent: 5051812 (1991-09-01), Onaki et al.
patent: 5091768 (1992-02-01), Yamazaki
patent: 5138427 (1992-08-01), Furuyama
patent: 5239270 (1993-08-01), Desbiens
patent: 5264377 (1993-11-01), Chesire et al.
patent: 5286676 (1994-02-01), Kruger et al.
patent: 5291142 (1994-03-01), Ohmi
patent: 5355020 (1994-10-01), Lee et al.
patent: 5448179 (1995-09-01), Burns
patent: 5475236 (1995-12-01), Yoshizaki
Nguyen Vinh P.
United Microelectronics Corporation
LandOfFree
Electromigration test pattern simulating semiconductor component does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electromigration test pattern simulating semiconductor component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromigration test pattern simulating semiconductor component will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1210001