Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating before depositing...
Patent
1998-12-02
2000-09-26
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Forming nonelectrolytic coating before depositing...
205184, 205224, 205118, 205210, 205222, C23C 2800, C23C 2802, C25D 550, C25D 502, C25D 534
Patent
active
061238252
ABSTRACT:
An electromigration-resistant copper film structure and the process for forming the structure. The film structure contains a high impurity content, is resistant to grain growth, and possesses superior metallurgical, thermo-mechanical, and electrical properties. The process comprises the steps of: (a) providing a seed layer at least indirectly on a substrate, the seed layer having an exposed surface; (b) immersing the substrate in a plating solution; (c) electrodepositing a copper-containing film on the exposed surface of the seed layer, the copper-containing film having a first surface; (d) maintaining the substrate in an immersed state within the plating solution; (e) electrodepositing a further copper-containing film from the plating solution onto the first surface; (f) removing the substrate from the plating solution; and (g) drying the substrate.
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Boettcher Steven H.
DeHaven Patrick W.
Parks Christopher C.
Simon Andrew H.
Uzoh Cyprian E.
Gorgos Kathryn
International Business Machines - Corporation
Townsend Tiffany L.
Wong Edna
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