Electromigration lifetime increase of lead base alloys

Details Electromigration lifetime increase of lead base alloys Electromigration lifetime increase of lead base alloys

1985-04-12

1986-11-11

Rutledge, L. Dewayne

Alloys or metallic compositions

Lead base

Silver containing

420570, 420573, C22C 1106

Patent

active

046222057

ABSTRACT:
Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

REFERENCES:
patent: 3600164 (1971-07-01), Harvey
Ghandi, VLSI Fabrication Principles, John Wiley and Sons, 1983, pp. 448-449.

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