Electromechanical module with small footprint and post-solder at

Details Electromechanical module with small footprint and post-solder at Electromechanical module with small footprint and post-solder at

1992-10-08

1994-04-26

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257707, 257719, H05K 720

Patent

active

053072391

ABSTRACT:
An electro-mechanical module comprises a packaged electrical part having a surface which dissipates heat, and a springy frame which overlies that surface. This frame includes a pair of fasteners for catching on the package at two predetermined locations, and the frame has an unstressed state in which the fasteners do not coincide with the two locations. However, the frame is springy enough to be stressed and thereby move the fasteners to the two locations, and thereafter return back towards the unstressed state and catch the fasteners on the package at the two locations. To complete the module, a heat sink rests on the surface and is removably attached to the frame.

REFERENCES:
patent: 4652973 (1987-03-01), Baker
patent: 4679118 (1987-07-01), Johnson
patent: 4745456 (1988-05-01), Clemens
patent: 4978638 (1990-12-01), Buller
patent: 5019940 (1991-05-01), Clemens
patent: 5132875 (1992-07-01), Plesinger
patent: 5208731 (1993-05-01), Blomquist

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