Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1999-01-19
2000-03-28
Donovan, Lincoln
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 67, 439 71, 439 74, H01R 909
Patent
active
060423889
ABSTRACT:
An electromechanical module with pressed electrical connections includes the following components: 1) a printed circuit board having a first array of I/O pads; 2) a substrate having a second array of I/O pads that are aligned with and face the first array of I/O pads; 3) compressible electrical contacts which lie between the first and second array of I/O pads; 4) a thin springy plate having a central section which presses against the printed circuit board in line with the first array of I/O pads, and having a springy periphery that extends in a quiescent state away; from the printed circuit board; and 5) a compressing means which compresses the electrical contacts by forcing the substrate towards the printed circuit board while bending the springy periphery of the thin-springy plate towards the substrate. When the plate is in a state where the electrical contacts are fully compressed, the thin-springy plate is relatively flat; and thus, the module has a low profile. Maximum deflection and stress in the printed circuit board are kept below an acceptable limit by selecting the particular locations where the central section of the thin springy plate presses against the board.
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Alton Leonard Harry
Tustaniwskyj Jerry Ihor
Donovan Lincoln
Fassbender Charles J.
Lee Richard K.
Samuels Steven B.
Starr Mark T.
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