Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-05-22
2007-05-22
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
11530932
ABSTRACT:
According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.
REFERENCES:
patent: 4641949 (1987-02-01), Wallace et al.
patent: 5220481 (1993-06-01), Swift et al.
patent: 5250756 (1993-10-01), Swift et al.
patent: 5281771 (1994-01-01), Swift et al.
patent: 5354607 (1994-10-01), Swift et al.
patent: 5414216 (1995-05-01), Swift et al.
patent: 5843567 (1998-12-01), Swift et al.
patent: 6872681 (2005-03-01), Niu et al.
patent: 6872791 (2005-03-01), Lee et al.
patent: 6891324 (2005-05-01), Dorfman
patent: 2005/0029009 (2005-02-01), Swift et al.
Deng Yuliang
Pecht Michael G.
Swift Joseph A.
Wallace Stanley J.
MH2 Technology Law Group
Prasad Chandrika
Xerox Corporation
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