Electromagnetically channelized microwave integrated circuit

Details Electromagnetically channelized microwave integrated circuit Electromagnetically channelized microwave integrated circuit

1996-04-01

1997-12-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 174 35R, 257659, 257660, 257728, 427 96, H05K 900

Patent

active

056943008

ABSTRACT:
A multi-chip module (10) has a plurality of functional circuits each disposed within its own cavity (15-18), each cavity separated from the other by isolation channels (20, 21). Each functional circuit includes a plurality of monolithic microwave or high speed digital integrated circuit chips (29-33) which are wire bonded or flip-chip attached to the multi-chip module, and each is encapsulated in plastic (37) overmold compound. Complete electromagnetic shielding is provided by depositing metal (23) over the channels and the plastic encapsulation, thereby providing a totally electromagnetically channelized and shielded multi-circuit, microwave and/or high speed digital integrated circuit board.

REFERENCES:
patent: 5151770 (1992-09-01), Inoue
patent: 5166864 (1992-11-01), Chitwood et al.
patent: 5309321 (1994-05-01), Olla et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5394304 (1995-02-01), Jones
patent: 5461545 (1995-10-01), Leroy et al.
patent: 5480840 (1996-01-01), Barnes et al.
patent: 5566055 (1996-10-01), Salvi, Jr.
patent: 5633786 (1997-05-01), Matuszewski et al.

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