Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1992-05-04
1994-11-22
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252518, 106 118, 106 125, 428364, 428372, 428402, 428484, H01B 100, H01B 120, H01B 122
Patent
active
053666640
ABSTRACT:
The present invention provides for conductive electromagnetic shielding (EMS) compositions which can be formulated to provide effective shielding over a broad range of frequencies, e.g. 30 MHz. to 110 GHz. which is based on a mixture of a polymeric or liquid matrix material and a synergestic combination of conductive powders, fibers and optional flake components. The invention also provides for formulations containing the above composition which are adapted for EMS applications such as pliable caulking, thermoformable shaped articles such as housings and cabinetry, flexible gasket material, shielding curtains, coatings and paints which may be applied to substrates such as glass, plastic or metal, structural composites, conformal coatings for printed circuit boards and like applications.
REFERENCES:
patent: 4552688 (1985-11-01), Sakamoto et al.
patent: 4554094 (1985-11-01), Babley et al.
patent: 4596670 (1986-06-01), Liu
patent: 4777205 (1988-10-01), LaScola et al.
patent: 4910389 (1990-03-01), Sherman et al.
patent: 4961879 (1990-10-01), May et al.
patent: 5075038 (1991-12-01), Cole et al.
patent: 5108791 (1992-04-01), Chung et al.
patent: 5171479 (1992-12-01), Maki et al.
Cresko Joseph W.
Varadan Vasundara V.
Varadan Vijay K.
Williams Neil R.
Kopec M.
Lieberman Paul
Monahan Thomas J.
The Penn State Research Foundation
LandOfFree
Electromagnetic shielding materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electromagnetic shielding materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromagnetic shielding materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1989424