Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate
2007-02-28
2009-08-04
Zimmerman, John J (Department: 1794)
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
C428S607000, C428S626000, C428S642000, C428S675000, C174S388000
Reexamination Certificate
active
07569282
ABSTRACT:
An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
REFERENCES:
patent: 4456508 (1984-06-01), Torday et al.
patent: 4469567 (1984-09-01), Torday et al.
patent: 5320919 (1994-06-01), Azuma et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5679230 (1997-10-01), Fatcheric et al.
patent: 7172818 (2007-02-01), Nakaoka et al.
patent: 2002/0011418 (2002-01-01), Manabe et al.
patent: 2002/0182432 (2002-12-01), Sakamoto et al.
patent: 1321061 (2001-11-01), None
patent: 1388841 (2003-01-01), None
patent: 0 709 494 (1996-05-01), None
patent: 1 394 291 (2004-03-01), None
patent: 09-087889 (1997-03-01), None
patent: 11-256389 (1999-09-01), None
patent: 2001-288595 (2001-10-01), None
patent: 2002-246712 (2002-08-01), None
patent: 2003-201597 (2003-07-01), None
patent: WO 2004/039137 (2004-05-01), None
European Search Report dated Dec. 21, 2005.
European Search Report dated Dec. 16, 2005 (EP-04-00-4493).
Chinese Office Action issue Apr. 3, 2009 for corresponding Chinese Application No. 2004100082169.
Kimijima Hisao
Yoshihara Yasuhisa
Kananen Ronald P.
Rader & Fishman & Grauer, PLLC
The Furukawa Electric Co. Ltd.
Zimmerman John J
LandOfFree
Electromagnetic shielding copper foil, method of production... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electromagnetic shielding copper foil, method of production..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromagnetic shielding copper foil, method of production... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4078159