Electromagnetic radiation reduction technique using grounded con

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174262, 361794, H05K 100

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active

053150694

ABSTRACT:
An EMR reduction technique using grounded conductive traces and vias circumscribing the internal planes of printed wiring boards. Conductive vias are placed in a circuitous path near the border and encircling the signal traces of each layer of a printed circuit board. The ground plane is extended to encompass and electrically ground each of the vias. For each signal plane, a conductive trace is routed and connected to each of the vias forming a grounded shield around the signal-carrying traces on the signal plane. For the power planes, a conductive trace is also provided connecting the conductive vias and forming a grounded shield around the power planes. A non-conductive path is provided between the power plane and the power plane conductive trace to electrically isolate the voltages of the power plane from the grounded conductive trace.

REFERENCES:
patent: 4916260 (1990-04-01), Broaddus et al.
patent: 5041700 (1991-08-01), Iyogi et al.
patent: 5102749 (1992-04-01), Enloe et al.
patent: 5183972 (1993-02-01), Duane et al.

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