Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-18
1999-03-09
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361695, 361704, 361818, 275717, 275718, 275719, 275727, 165 803, H05K 720
Patent
active
058809309
ABSTRACT:
A EMI shield which includes a heat sink and a compression coupling. A top housing formed of electrically conductive material is placed over a circuit board containing electronic devices and is electrically coupled to an electrical ground through contact along the length of a conductive strip which is connected to an electrical ground. A bottom housing formed of electrically conductive material is connected to an electrical ground through electrical contact along the length of a conductive strip located on the bottom of the circuit board so as to form a EMI shielding enclosure. The top housing is formed of thermally conductive material and includes extended surfaces for conducting heat away from the electronic devices contained below the top housing. In addition, the bottom housing is formed of thermally conductive material so as to form a thermally conductive enclosure which acts as a heat sink, effectively cooling the electronic devices contained therewithin. A compression coupling mechanism which uses springs to press the top housing towards the bottom housing gives consistent electrical contact between a microprocessor and a circuit board.
REFERENCES:
patent: 5430611 (1995-07-01), Patel et al.
Chervinsky Boris L.
Picard Leo P.
Silicon Graphics Inc.
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