Electromagnetic interference preventing module

Details Electromagnetic interference preventing module Electromagnetic interference preventing module

2009-09-11

2011-12-13

Ngo, Hung (Department: 2835)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C174S387000, C361S816000, C439S607130

Reexamination Certificate

active

08076592

ABSTRACT:
An electromagnetic interference preventing module is provided. The module includes a metal pad that is disposed on a circuit board. The metal pad includes a soldering portion and a grounding portion that are connected to each other. At least one fixing lug of a connector is soldered to the soldering portion. At least one protrusion of a grounding housing is in contact with the grounding portion, so as to electrically connect the connector with the grounding housing.

REFERENCES:
patent: 6235985 (2001-05-01), Dai
patent: 6538196 (2003-03-01), MacDonald et al.
patent: 6629365 (2003-10-01), Denzene et al.
patent: 6858793 (2005-02-01), Pels et al.
patent: 6872880 (2005-03-01), King et al.
patent: 6958445 (2005-10-01), Boudreaux et al.
patent: 6972963 (2005-12-01), Chou
patent: 6979773 (2005-12-01), Fursich
patent: 6979774 (2005-12-01), Abe et al.
patent: 6995314 (2006-02-01), Gottwald
patent: 7202422 (2007-04-01), Ogatsu
patent: 7351919 (2008-04-01), Knoke et al.
patent: 2003/0024717 (2003-02-01), Knighten et al.

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