Electromagnetic interference and radio frequency absorbing...

Details Electromagnetic interference and radio frequency absorbing... Electromagnetic interference and radio frequency absorbing...

2011-03-01

2011-03-01

Ngo, Hung V (Department: 2835)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C428S323000, C342S001000

Reexamination Certificate

active

07897882

ABSTRACT:
An EMI/RF absorbing film may comprise a polymer resin, and metallic flakes dispersed in the resin. A method for manufacturing an EMI/RF absorbing material. The method may include dispersing metallic flake in the polymer resin, applying the polymer resin and dispersed metallic flake on a releasable medium, curing the polymer resin to form a film, and releasing the cured polymer resin film from the release medium.

REFERENCES:
patent: 5091242 (1992-02-01), Chung
patent: 7488901 (2009-02-01), Arnold
patent: 2002/0148626 (2002-10-01), Matsumura et al.
patent: 2004/0022358 (2004-02-01), Tomita
patent: 2006/0099403 (2006-05-01), Johnson
patent: WO 2006022463 (2006-03-01), None
Wave-X®, EMI Suppression and Absorption, date unknown, 6 pages, ARC Technologies, Inc.

Affiliated with

Also associated with

Rating

Electromagnetic interference and radio frequency absorbing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electromagnetic interference and radio frequency absorbing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromagnetic interference and radio frequency absorbing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2632576