Electromagnetic interference and heatsinking

Details Electromagnetic interference and heatsinking Electromagnetic interference and heatsinking

2002-04-16

2003-06-24

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S818000, C257S660000, C257S659000, C174S034000

Reexamination Certificate

active

06583987

ABSTRACT:

BACKGROUND
This invention relates to electromagnetic interference and heat dissipating devices such as heatsinks.
Heat sinks act like radiation antennas, which can generate electromagnetic radiation levels that exceed U.S. and European regulations.
A large heatsink that is close to a high frequency microprocessor may behave as an antenna of electromagnetic radiation induced by the microprocessor. The emitted electromagnetic radiation can affect the performance of nearby devices.
SUMMARY
In a first aspect, an apparatus includes a semiconductor device and a heat dissipating device (e.g., a heatsink) thermally coupled to the semiconductor device. The heat dissipating device is located and formed to screen the semiconductor device from external electromagnetic radiation or to contain radiation produced by the semiconductor device.
In a second aspect, an apparatus includes a semiconductor device, a heat dissipating device thermally coupled to the semiconductor device, and a grounding structure. The grounding structure has a capacitive coupling to the heat dissipating device.


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