Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters
Patent
1994-04-04
1996-06-11
Lee, Benny
Wave transmission lines and networks
Coupling networks
Frequency domain filters utilizing only lumped parameters
333202, H03H 700
Patent
active
055259430
ABSTRACT:
An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.
REFERENCES:
patent: 4782310 (1988-11-01), Saburi et al.
patent: 4791391 (1988-12-01), Linnell et al.
patent: 4814946 (1989-03-01), Su
patent: 4821005 (1989-04-01), Kling
patent: 4931754 (1990-06-01), Moussie
patent: 4945323 (1990-07-01), Gerstenberg et al.
patent: 4967316 (1990-10-01), Goebel et al.
patent: 5055635 (1991-10-01), Landsmann et al.
patent: 5113155 (1992-05-01), Funada
patent: 5150086 (1992-09-01), Ito
patent: 5167539 (1992-12-01), Okamoto et al.
patent: 5300903 (1994-04-01), Okamura et al.
patent: 5351020 (1994-09-01), Okamura et al.
patent: 5374907 (1994-12-01), Orita et al.
Lipphardt Uwe
Roethlingshoefer Walter
Tauber Peter
Weiblen Kurt
Gambino Darius
Lee Benny
Robert & Bosch GmbH
LandOfFree
Electromagnetic compatibility filter utilizing inherently formed does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electromagnetic compatibility filter utilizing inherently formed, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromagnetic compatibility filter utilizing inherently formed will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-354707