Electromagnetic bandgap structure and printed circuit board

Details Electromagnetic bandgap structure and printed circuit board Electromagnetic bandgap structure and printed circuit board

2008-09-17

2011-12-13

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

Wave filters including long line elements

C333S246000

Reexamination Certificate

active

08077000

ABSTRACT:
Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

REFERENCES:
patent: 6002593 (1999-12-01), Tohya et al.
patent: 7123118 (2006-10-01), McKinzie, III
patent: 1201363 (1998-12-01), None
patent: 6-181389 (1994-06-01), None
Chinese Office Action mailed Jul. 14, 2011 in corresponding Chinese Patent Application 200810171136.3.
Japanese Office Action dated Aug. 2, 2011 in corresponding Japanese Patent Application 2008-250877.

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