Electromagnetic bandgap structure and printed circuit board

Wave transmission lines and networks – Long line elements and components – Strip type

Reexamination Certificate

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C333S167000

Reexamination Certificate

active

08081052

ABSTRACT:
An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

REFERENCES:
patent: 6483045 (2002-11-01), Wang et al.
patent: 7204018 (2007-04-01), Kwong et al.
patent: 2009/0039984 (2009-02-01), Kim et al.
patent: 10-209726 (1998-08-01), None
patent: 2004-032232 (2004-01-01), None
Japanese Office Action, with Partial English Translation, issued in Japanese Patent Application No. 2008-295834, dated Feb. 1, 2011.

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