Electromagnetic bandgap structure and printed circuit board...

Details Electromagnetic bandgap structure and printed circuit board... Electromagnetic bandgap structure and printed circuit board...

2011-05-17

2011-05-17

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Transmission line inductive or radiation interference...

C333S167000, C333S185000

Reexamination Certificate

active

07944320

ABSTRACT:
An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

REFERENCES:
patent: 7136029 (2006-11-01), Ramprasad et al.
patent: 2010/0108373 (2010-05-01), Park

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