Electromagnetic bandgap structure and printed circuit board

Details Electromagnetic bandgap structure and printed circuit board Electromagnetic bandgap structure and printed circuit board

2011-06-21

2011-06-21

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S321200, C361S748000, C361S794000, C174S255000, C174S256000, C174S260000, C174S262000, C257S533000, C257S621000, C257S664000, C257S665000, C343S909000

Reexamination Certificate

active

07965521

ABSTRACT:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

REFERENCES:
patent: 6353540 (2002-03-01), Akiba et al.
patent: 7298234 (2007-11-01), Dutta
patent: 2002/0180004 (2002-12-01), Oggioni et al.
patent: 2005/0029632 (2005-02-01), McKinzie et al.
patent: 7-263908 (1995-10-01), None
patent: 2002-171107 (2002-06-01), None
patent: 2003-133801 (2003-05-01), None
patent: 2006-261651 (2008-09-01), None
Japanese Office Action issued May 18, 2010 in corresponding Japanese Patent Application 2008-043333.
Taiwanese Office Action dated Oct. 21, 2010, issued in corresponding Taiwanese Patent Application No. 097100737.

Affiliated with

Also associated with

Rating

Electromagnetic bandgap structure and printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electromagnetic bandgap structure and printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromagnetic bandgap structure and printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2638622