Electrolytic tin plating process with reduced sludge production

Details Electrolytic tin plating process with reduced sludge production Electrolytic tin plating process with reduced sludge production

1998-08-20

2000-02-08

Mayekar, Kishor

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205252, 205253, 205300, 205302, C25D 504

Patent

active

060224673

ABSTRACT:
Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 4-70 g/L tin ion and a grain refiner, and 1-4% nonylphenol ethoxylated with 8-10 ethylene oxide groups, having a weight average molecular weight of 616.+-.18, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foot or more.

REFERENCES:
patent: 3977949 (1976-08-01), Rosenberg
patent: 4139425 (1979-02-01), Eckles et al.
patent: 4545870 (1985-10-01), Rosenberg
patent: 4582576 (1986-04-01), Opaskar et al.
patent: 5814202 (1998-09-01), Ilgar
Hirsch and Rosenstein, "Tin, Lead, and Tin-Lead Plating" Metal Finishing Guidebook and Directory Issue '96, pp. 289-304, No Month Available.

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