Electrolytic plating method and semiconductor device...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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C205S137000, C205S157000

Reexamination Certificate

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08080147

ABSTRACT:
A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies D×N×π≦6000×π (mm/min), where D is the diameter of the substrate (mm), and D×N×π represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm2or less. In the second step, the substrate is rotated at a second speed higher than the first speed, and the current is supplied to the substrate at a second density higher than the first density.

REFERENCES:
patent: 6551487 (2003-04-01), Reid et al.
patent: 2001-181895 (2001-07-01), None
patent: 2002-115097 (2002-04-01), None
patent: 2004-315889 (2004-11-01), None

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