Electrolytic plating

Details Electrolytic plating Electrolytic plating

1979-12-31

1982-01-12

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 43R, 204 43Z, 204 43T, 204 43G, 204 43N, 204 44, 204 45R, 204 46R, 204 46G, 204 47, 204 48, 204 49, 204 50R, 204 51, 204 52Y, 204 55R, G01N 338, G01N 314, G01N 322, G01N 352

Patent

active

043103928

ABSTRACT:
The electroplating of various metals such as zinc, copper, cadmium, chromium, nickel cobalt, gold, silver, palladium, platinum, ruthenium and alloys of such metals takes place from electrolytes comprising heterocyclic additives such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones. Specific examples of such additives are phenolphthalein, phthalide, phenolsulfone-phthalein, naphtholphthalein, 2-benzoxazdinone and phthalimide. These additives may be used in conjunction with various polyethers to permit high plating rates, constant plating thicknesses over wide areas and smooth coatings.

REFERENCES:
patent: 2782155 (1957-02-01), Du Rose et al.
patent: 4089755 (1978-05-01), Steinecker
APC 351,241, Robert Weiner, May 18, 1943.
A. Kenneth Graham et al., Tech. Proc. Am. Electroplater's Soc., vol. 50, pp. 139-146, (1963).

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