Electrolytic organic mold flash removal

Details Electrolytic organic mold flash removal Electrolytic organic mold flash removal

1988-03-02

1988-11-01

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

C25F 100

Patent

active

047818042

ABSTRACT:
This invention comprehends an improved method for uniformly loosening and removing the thin layer of mold flash which deposits on the surface of the metal lead frames during encapsulation of the silicon integrated circuit chips bonded to that metal lead frame surface. The disclosed method does not adversely effect the underlying metal material or the encapsulating plastic material enveloping the silicon integrated circuit chip. The disclosed method is electrolytic and employs (1) the chemical dissolving action of the stripping solution and (2) the percolating effect of the hydrogen gas generated during electrolysis of the water, to loosen the unwanted organic mold flash from the metal lead frame surface. The disclosed electrolytic method for removal of mold flash employs an aqueous based stripping solution preferably comprising;

REFERENCES:
patent: 2765267 (1956-10-01), Dorst
patent: 3847839 (1974-11-01), Murphy

Affiliated with

Also associated with

Rating

Electrolytic organic mold flash removal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrolytic organic mold flash removal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrolytic organic mold flash removal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-889408