Electrolytic method for the dissolution of copper particles form

Details Electrolytic method for the dissolution of copper particles form Electrolytic method for the dissolution of copper particles form

1989-05-10

1990-07-03

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 93, 204 96, 204140, 427 98, 427305, 427345, 4274431, C25B 100, C23C 1854, C23C 1838

Patent

active

049388533

ABSTRACT:
Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.

REFERENCES:
patent: Re31694 (1984-10-01), Slominski et al.
patent: 4209331 (1980-06-01), Kukanski et al.
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4459184 (1984-07-01), Kukanskis
patent: 4671968 (1987-06-01), Slominski
patent: 4719128 (1988-01-01), Krulik
Kinoshita et al., Stoichiometry of Anodic Copper Dissolution at High Current Densities, J. Electrochemical Soc., vol. 117, No. 10 (Oct. 1970).

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