Electrolytic method for forming vias and through holes in copper

Details Electrolytic method for forming vias and through holes in copper Electrolytic method for forming vias and through holes in copper

1991-02-06

1992-04-28

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

20412975, C25F 303

Patent

active

051085623

ABSTRACT:
Disclosed is a method of fabricating a microelectronic package having least one layer formed of a Cu-Invar-Cu core encapsulated between a pair of dielectric films. The package is intended to carry surface circuitization on an external surface, with internal circuitization from the surface circuitization passing through the core. The method includes contacting the copper within the Cu-Invar-Cu core with a copper etching aqueous solution of a strong base and a strong oxidizing acid, while maintaining the copper anodic. This electrolytically converts the copper to soluble copper oxides. In a separate step the Invar of the Cu-Invar-Cu core is electrolytically etched with an Invar etching aqueous solution of sodium chloride. This step is carried out under conditions to electrolytically form soluble iron and nickel chlorides while passivating the copper.

REFERENCES:
patent: 4543153 (1985-09-01), Nelson

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