Electrolytic layer applied to metallic foil to promote adhesion

Details Electrolytic layer applied to metallic foil to promote adhesion Electrolytic layer applied to metallic foil to promote adhesion

1997-12-22

2000-05-09

Kopec, Mark

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, 428607, 428612, 428675, 428678, H05K 103, B21C 3700

Patent

active

060606665

ABSTRACT:
A metallic foil, and a process for producing the same, having a metallic micro-layer electrodeposited on a surface of the foil, wherein the micro-layer comprises two co-deposited metals each being a metal other than the metal forming the foil, and does not change the topography of the surface on which it is deposited. The foil may be formed of copper, and the micro-layer may be formed of iron and nickel. When bonded to a polymeric substrate the peel strength of the foil is improved.

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patent: 3857681 (1974-12-01), Yates et al.
patent: 3918926 (1975-11-01), Wolski et al.
patent: 4935310 (1990-06-01), Nakatsugawa
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5709957 (1998-01-01), Chiang et al.

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