Electrolytic gold plating

Details Electrolytic gold plating Electrolytic gold plating

1979-12-21

1982-01-12

Williams, Howard S.

Chemistry: electrical and wave energy

Processes and products

204 43G, 204290F, C25D 348, C25D 356, C25D 362, C25D 1710

Patent

active

043103910

ABSTRACT:
A particular type of electrode structure is described which is useful as a counter electrode in gold plating processes. The electrode surface comprises oxides of certain group eight elements and oxides of certain valve metals. A process for preparing the electrodes is also described. Such electrodes or anodes exhibit long life and reduced undesirable side reactions in the gold plating process. For example, consumption of buffer material is greatly reduced and formation of trivalent gold is reduced.

REFERENCES:
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patent: 3491014 (1970-01-01), Bianchi et al.
patent: 3616445 (1971-10-01), Bianchi et al.
patent: 3632496 (1972-01-01), Beer
patent: 3711385 (1973-01-01), Beer
patent: 4067783 (1978-01-01), Okinaka et al.
Cipris et al., Journal of Elect. Chem., vol. 73 (1976) pp. 125-128.
Reid et al., Gold Plating Tech. Electrochemical Publications Ltd. (1974) pp. 21-52.
Modern Electroplating, John Wiley & Sons, N. Y., Edited by F. A. Lowenheim, 2nd Ed. (1963) pp. 224-244.

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