Electrolytic deposition and recovery of silver

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating

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C25D 346

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active

H00011363

ABSTRACT:
A method for electroplating sliver is described which comprises a plating and/or stripping solution of an alkali hydroxide and ethylenediamine having a basic pH in the range of about 7.5 to 13, and having an ethylenediamine concentration of about 5 to 33% by volume, the electroplating (at the cathode) and/or stripping (at the anode) being performed with an applied DC potential across the electrodes of about 2 to 6 volts.

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patent: 4478691 (1984-10-01), Abys
patent: 4652465 (1987-03-01), Koto et al.
"Electroplating Baths for Silver", Natarajan et al., Metal Finishing (Feb. 1991).
"Stripping of Nickel Deposits with Ethylene Diamine", Natarajan et al., Metal Finishing (Dec. 1984).
Chemical Abstract: 81:85272k, Oct. 7, 1974.
Chemical Abstract 95: 158643h, Nov. 2, 1981.

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