Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate
Patent
1994-07-28
1995-10-03
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly nonmetal substrate
205125, 205164, 205166, 205169, 205296, 205916, C25D 338, C25D 554
Patent
active
054549302
ABSTRACT:
An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.
REFERENCES:
patent: 2644787 (1953-07-01), Bonn
patent: 4228201 (1980-10-01), Feldstein
patent: 4459184 (1984-07-01), Kukawskis
patent: 4478690 (1984-10-01), Scholtens
patent: 5059243 (1991-10-01), Sagannathan et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 152-155, 420-423.
Miura Takeshi
Seita Masaru
Leader William T.
Learonal Japan Inc.
Lobato Emmanuel J.
Niebling John
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