Electrolysis: processes – compositions used therein – and methods – Electrolytic coating
Reexamination Certificate
2008-05-20
2008-05-20
Tsang-Foster, Susy (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
C420S469000, C420S499000
Reexamination Certificate
active
10478750
ABSTRACT:
The present invention pertains to an electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1500 μm (or more) to 20000 μm in an electrolytic copper plating method employing a phosphorous copper anode. Upon performing electrolytic copper plating, an object is to provide an electrolytic copper plating method of a semiconductor wafer for preventing the adhesion of particles, which arise at the anode side in the plating bath, to the plating object such as a semiconductor wafer, a phosphorous copper anode for electrolytic copper plating, and a semiconductor wafer having low particle adhesion plated with such method and anode.
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Aiba Akihiro
Okabe Takeo
Howson & Howson LLP
Nippon Mining & Metals Co., Ltd.
Smith Nicholas A.
Tsang-Foster Susy
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