Electrolytic copper plating bath and plating process therewith

Details Electrolytic copper plating bath and plating process therewith Electrolytic copper plating bath and plating process therewith

2007-05-22

2007-05-22

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S123000, C205S125000, C205S297000, C205S298000, C106S001260

Reexamination Certificate

active

11181856

ABSTRACT:
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary polyvinylimidazolium compound represented by the following formula (1) and a copolymer, represented by the following formula (2), of vinylpyrrolidone and a quaternary vinylimidazolium compound:where R1and R2are each an alkyl group, m is an integer of not less than 2, and p and q are each an integer of not less than 1, and a copper electroplating method for via-filling plating of blind via-holes formed on a substrate by use of the electrolytic copper plating bath.

REFERENCES:
patent: 3502551 (1970-03-01), Todt et al.
patent: 2005/0016858 (2005-01-01), Barstad et al.

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