Electrolytic copper-plated R-T-B magnet and plating method...

Details Electrolytic copper-plated R-T-B magnet and plating method... Electrolytic copper-plated R-T-B magnet and plating method...

2005-03-15

2005-03-15

Koehler, Robert R. (Department: 1775)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S170000, C205S181000, C205S182000, C205S191000, C205S271000, C205S295000, C205S296000, C205S318000, C205S319000, C428S645000, C428S646000, C428S647000, C428S657000, C428S658000, C428S670000, C428S672000, C428S673000, C428S674000, C428S675000, C428S680000, C428S472100, C428S472300, C428S935000

Reexamination Certificate

active

06866765

ABSTRACT:
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

REFERENCES:
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patent: 60-54406 (1985-03-01), None
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patent: 7-176443 (1995-07-01), None
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patent: 2000-133541 (2000-05-01), None
patent: WO 9923675 (1999-05-01), None

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