Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1998-03-04
1999-11-23
Zimmerman, John J.
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428612, 428626, 428675, 428687, 205111, 205182, B32B 1508, B32B 1520, C25D 706
Patent
active
059897279
ABSTRACT:
Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.
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Bodendorf Keith
Cheng Chinsai T.
Dufresne Paul
Gaskill George
Wolski Adam
Circuit Foil U.S.A., Inc.
Zimmerman John J.
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