Electrolyte and method for depositing tin-silver alloy layers

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

Reexamination Certificate

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C106S001230, C106S001260

Reexamination Certificate

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06998036

ABSTRACT:
The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin (II) salts, one or more soluble silver (I) salts and one or more organic sulfur compounds with one or more thioether functional units and/or ether functional units of the general formula R—Z—R′—, wherein R and R′ are the same or different non-aromatic organic groups, and Z represents S or O. The invention further relates to a method using the electrolyte and to the coating obtainable by the inventive method as well as to the use of the electrolyte for coating electronic components.

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M. Ohhara, M. Yuasa, “A study of alkaline Sn-Ag alloy plating bath-The relation between complexing agents and deposition behaviours”, Tokyo Univ. of Science, 1996, no month.
T.Kondo, et al., “Bright Tin-Silver Alloy Electrodeposition from an Organic Sulfonate Bath Containing Pyrophosphate, Iodide & Triethanolamine as Chelating Agents”, Plating and Surface Finishing, American Electroplaters Society, Inc., vol. 85, No. 2, Feb. 1998, pp. 51-55.
Abstract of Japanese Patent No. 2000 192279, dated Nov. 17, 2000.

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