Electrolyte and method for depositing tin-copper alloy layers

Details Electrolyte and method for depositing tin-copper alloy layers Electrolyte and method for depositing tin-copper alloy layers

2007-02-20

2007-02-20

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

Reexamination Certificate

active

10380842

ABSTRACT:
The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula —R—Z—R′—(R and R′ are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components.

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