Electroless tin and tin-lead alloy plating baths

Details Electroless tin and tin-lead alloy plating baths Electroless tin and tin-lead alloy plating baths

1975-05-06

1978-06-06

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427437, C23C 302

Patent

active

040934667

ABSTRACT:
Salt compositions and baths thereof useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount of from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative. Preferably the salt elements are stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as a agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

REFERENCES:
patent: 2369620 (1945-02-01), Sullivan et al.
patent: 3050410 (1962-08-01), Greene
patent: 3303029 (1967-02-01), Shipley

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