Electroless tin and tin-lead alloy plating baths

Details Electroless tin and tin-lead alloy plating baths Electroless tin and tin-lead alloy plating baths

1977-12-05

1980-03-25

Smith, John D.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

204 43S, 427436, 427437, 427 98, C23C 302

Patent

active

041949137

ABSTRACT:
An aqueous bath useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative; the bath solution contains stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as an agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

REFERENCES:
patent: 2369620 (1945-02-01), Sullivan
patent: 3050410 (1962-08-01), Greene
patent: 3303029 (1967-02-01), Shipley
patent: 3409466 (1968-11-01), Slay et al.
patent: 3689292 (1972-09-01), Preston
patent: 3971861 (1976-07-01), Waltoff
patent: 4053372 (1977-10-01), Davis
patent: 4093466 (1978-06-01), Davis

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