Electroless solder plating bath

Details Electroless solder plating bath Electroless solder plating bath

1993-08-02

1994-11-01

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 125, 4274431, C23C 1848, C23C 1852

Patent

active

053604717

ABSTRACT:
Disclosed herein is an electroless solder plating bath capable of autocatalytically depositing solder on a metal such as copper or nickel or an activated non-conductor base material in an arbitrary film thickness and an arbitrary film composition. This plating bath contains bivalent ions of tin and bivalent ions of lead as metal ions, a complexing agent, and a reductant, while the reductant contains trivalent titanium ions. The plating bath can be used at a temperature of 40.degree. to 80.degree. C., with a pH value of 5.0 to 11.0.

REFERENCES:
patent: 4194913 (1980-03-01), Davis
patent: 5143544 (1992-09-01), Iantosca
patent: 5160373 (1992-11-01), Senda et al.
patent: 5169692 (1992-12-01), Couble et al.
patent: 5173109 (1992-12-01), Iantosca
"Electroless Tin Plating Bath", C-836, May 29, 1991, vol. 15, No. 211, Yutaka Kawabe.
"Electroless Plating Bath", C-885, Nov. 15, 1991, vol. 15, No. 450, Tetsuo Senda.

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