Electroless silver plating composition

Details Electroless silver plating composition Electroless silver plating composition

1993-02-22

1994-06-21

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, 428680, C23C 1831, B05D 118, B32B 1500

Patent

active

053225538

ABSTRACT:
An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.

REFERENCES:
patent: 4798626 (1989-01-01), Perovetz et al.
patent: 4925491 (1990-05-01), Perovetz et al.

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