Electroless pure palladium plating solution

Details Electroless pure palladium plating solution Electroless pure palladium plating solution

2011-07-19

2011-07-19

Klemanski, Helene (Department: 1734)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001280

Reexamination Certificate

active

07981202

ABSTRACT:
An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.

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International Search Report issued in corresponding International Application No. PCT/JP2007/054370, Jun. 2007.

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