Electroless plating with bi-level control of dissolved oxygen, w

Details Electroless plating with bi-level control of dissolved oxygen, w Electroless plating with bi-level control of dissolved oxygen, w

1990-04-12

1990-11-06

Beck, Shrive

Coating apparatus

Immersion or work-confined pool type

With tank structure, liquid supply, control, and/or...

118690, 4274431, 427 98, B05C 300

Patent

active

049676903

ABSTRACT:
Nodule formation in a continuous electroless copper plating system is minimized by independently controlling the dissolved oxygen contents on the plating solution in the bath and in the associated external piping. The level of dissolved oxygen in the plating tank is maintained at a value such that satisfactory plating takes place. At the point where the plating solution leaves the tank, additional oxygen gas is introducted into the solution so that the level of dissolved oxygen in the plating solution in the external piping is high enough to prevent any plating from taking place in the external piping and so that in the external piping the copper is etched or dissolved back into solution. At the end of the external piping, the dissolved oxygen level is reduced so that the dissolved oxygen level of the plating solution in the tank is maintained at the level where plating will take place.

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