Electroless plating with bi-level control of dissolved oxygen

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427345, 4274431, 106 123, C23C 1840

Patent

active

046845453

ABSTRACT:
Nodule formation in a continuous electroless copper plating system is minimized by independently controlling the dissolved oxygen contents on the plating solution in the bath and in the associated external piping. The level of dissolved oxygen in the plating tank is maintained at a value such that satisfactory plating takes place. At the point where the plating solution leaves the tank, additional oxygen gas is introduced into the solution so that the level of dissolved oxygen in the plating solution in the external piping is high enough to prevent any plating from taking place in the external piping and so that in the external piping the copper is etched or dissolved back into solution. At the end of the external piping, the dissolved oxygen level is reduced so that the dissolved oxygen level of the plating solution in the tank is maintained at the level where plating will take place.

REFERENCES:
patent: 4152467 (1979-05-01), Alpaugh
patent: 4162217 (1979-07-01), Herrmann
patent: 4525390 (1985-01-01), Alpaugh
patent: 4534797 (1985-08-01), King
patent: 4554184 (1985-11-01), Canestaro
patent: 4565575 (1986-01-01), Cardin

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