Electroless plating structure

Details Electroless plating structure Electroless plating structure

2007-10-09

2007-10-09

Lavilla, Michael E. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S675000, C428S704000, C438S648000, C438S650000, C438S666000, C438S678000, C438S687000, C257S762000, C257S763000

Reexamination Certificate

active

10649087

ABSTRACT:
The present invention relates to a cobalt electroless plating bath composition. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.

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Derwent abstract of JP61/186275, Aug. 1986, 3 pages.

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