Electroless plating-resisting ink composition

Details Electroless plating-resisting ink composition Electroless plating-resisting ink composition

1990-10-09

1992-10-27

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 83, 522166, 522170, 523443, 523466, C08K 336, C08K 554, C08K 906, C08L 6302

Patent

active

051589893

ABSTRACT:
A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.

REFERENCES:
patent: 4251576 (1981-02-01), Osborn et al.
patent: 4394434 (1983-07-01), Rohloff
patent: 4622349 (1986-11-01), Koleske et al.
patent: 4684671 (1987-08-01), Tsuchiya et al.
patent: 4732961 (1988-03-01), Oka
Patent Abstracts of Japan, vol. 13, No. 379 (c-288) Aug. 22, 1989.
Patent Abstracts of Japan, vol. 13, No. 261 (P-885) Jun. 16, 1989.
Patent Abstracts of Japan, vol. 9, No. 153(C-288) Jun. 27, 1985.

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