Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1995-11-16
1997-07-15
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427 97, 427 98, 427210, 427259, 427264, 427265, 427270, 427272, 427282, 427304, 427404, 4274431, 427510, 427535, 427553, 427576, C23C 1402
Patent
active
056481250
ABSTRACT:
There is disclosed a process for electroless plating of a conductive metal layer onto the surface of a non-conductive substrate, in which the substrate surface is prepared for receiving a coating of activator using conventional methods, and the coating of activator is applied by contacting the substrate surface with a stabilized sensitizing solution comprising ions of at least one Group VIII and IB transition metal, preferably palladium chloride, stannous ions in a molar concentration in excess of that of the transition metal ions, an acid, and a buffering salt; followed by contacting the sensitized substrate surface with a noble metal activating solution to catalyze the substrate surface for subsequent electroless plating. The sensitized and activated substrate is then contacted with an aqueous dry film photoresist, which is then imaged and developed to form a predetermined electrical circuit pattern, using conventional methods. The cleaned and imaged substrate is then immersed in an acidic electroless nickel metal depositing solution, for a time, at a concentration, and at a temperature sufficient to prepare the substrate for subsequent pattern electroplating, said acidic electroless metal depositing solution comprising ions of nickel, a complexing agent, a reducing agent capable of reducing said metal ions to a metallic state in an acidic medium, provided that said reducing agent does not include formaldehyde or a formaldehyde generating composition, one or more stabilizers, and water.
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